位置：中游情绪：利好参考度：10/10
三星电子、SK海力士等存储供应商已上调明年HBM3E价格，涨幅接近20%。一般而言，新一代HBM产品面世前，供应商通常下调前代产品价格，本次涨价在业内较为罕见。
这一现象由供需两端共同驱动。供应端，存储厂商预计明年第六代HBM（HBM4）需求增长，加大产能投入，导致HBM3E产能积压；需求端，除英伟达外，谷歌、亚马逊等企业订单量大幅增加。其中，英伟达H200芯片每颗搭载6颗HBM3E；谷歌第七代TPU与亚马逊Trainium将于明年出货，两款产品HBM搭载量较上一代提升20%至30%，前者每颗搭载8颗HBM3E，后者搭载4颗。
KB Securities指出，由于ASIC需求激增，以ASIC为核心客户的三星，2026年HBM总出货量有望较2025年...
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